Agilent Technologies 8510C Manuel de service Page 116
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3-46 8510XF Network Analyzer Systems
Operation
Operation Using a Wafer Probe Station
Operation Using a Wafer Probe Station
System Configuration For on-wafer measurements, it is usually best to remove the network
analyzer from the instrument rack, and place it on a table adjacent to the
probe station. This allows for easy viewing of the analyzer display, and easy
access to the analyzer’s front panel controls.
The test heads are placed on X-Y positioners on the probe station. Locations
on a probe station are conventionally referred to in terms of compass points;
accordingly, the left test head is placed on the “west” positioner, and the
right test head is placed on the “east” positioner.
Figure 3-23 Wafer Probe Configuration
- Operating and Service 1
- Restricted Rights Legend 2
- Warranty 4
- Contacting Agilent 5
- Instrument Markings 7
- Safety Requirements 7
- Safety Earth 7
- Typeface Conventions 9
- Compliance with Standards 10
- Contents 13
- 1 Introduction 17
- Finding System Information 18
- Introduction 19
- Two Versions of the 21
- System Description 22
- Wafer Probe 23
- (45 MHz to 2 GHz) 24
- (RF Passthrough) 24
- Option 010 25
- (Time Domain) 25
- Option 230 25
- (Line Voltage) 25
- Upgrade Paths 26
- Upgrade Kits for the 27
- 85106C/D 27
- (With Option 002) 28
- 2 Installation 29
- Site Preparation 30
- Environmental 31
- Requirements 31
- Weight and dimensions 32
- Agilent Technologies 33
- Customer Engineering 33
- In Case of Problems 33
- Installation 34
- Receiving the System 34
- Precautions 37
- Electrostatic 38
- Discharge 38
- Test Port Inputs 38
- Cleaning 38
- Unpacking the System 39
- Safety Glasses 40
- Foam cover 41
- Figure 2-5 Removing the Bolts 42
- Unload the system 43
- Basic System Configurations 45
- Basic System Configurations 46
- Installing the Work 48
- Test Heads 54
- Systems With 56
- Instruments Without 58
- Cable List 60
- Other Connections 65
- Turning On the System 66
- System Operational Test 67
- Test Procedure Setup 68
- Operating Notes 70
- • Start: −35 dBm 70
- • Stop: −15 dBm 70
- 3 Operation 71
- 8510XF Operating System 72
- Menu Conventions 73
- Used in this Chapter 73
- • {TRIM SWEEP} is deleted 74
- • {RAMP} is deleted 74
- Measurement Calibration 76
- • SOLT (Short-Open-Load-Thru) 77
- • TRL (Thru-Reflect-Line) 77
- • TRM (Thru-Reflect-Match) 77
- On-wafer calibration 78
- Calibration Procedure 79
- Connect and Measure 80
- Non-Banded 82
- Calibration Types 83
- Select ONE of the 84
- Response Standards 84
- Standard Types 90
- • S11 1-Port calibrations 91
- • S22 1-Port calibrations 91
- • Full 2-Port calibrations 91
- One-Path 94
- Transmission 94
- One-Path Isolation 95
- Standard 95
- Full 2-Port 96
- Full 2-Port Isolation 97
- Port Power 98
- RF Power 100
- Unleveled/Overmod 101
- Detection 101
- Explanation 101
- Reset Detector Gain 102
- Calibration 102
- Operation 103
- LO Power 106
- IF Frequency 112
- Broadband SOLT 114
- Broadband TRM 115
- Standards 115
- Types of Probe 117
- Stations 117
- 4 Performance Verification 119
- Verification Overview 120
- • Frequency of use 120
- • Amount of cable movement 120
- Calibration and 121
- Frequency Ranges 121
- Frequency ranges 122
- Verification Setup 123
- Software 124
- Configuration 124
- Performance Verification 125
- Verification Setup 125
- Printer Selection 126
- Verification Procedures 127
- Verification Procedures 128
- Table 4-6) 129
- 12. Select 129
- High Band Verification 130
- (> 50 GHz) 130
- CW Frequency Accuracy Test 132
- • 10 dB pad 132
- CW Frequency Accuracy Test 133
- Performance Test 134
- Calibration Storage Locations 135
- Calibration Techniques: 135
- Clarifying Connector Sex: 135
- Offset Shorts: 135
- 5 System Maintenance 137
- Electrostatic Discharge 138
- 1.0 mm Connector Care 139
- Mating plane surfaces 140
- Connector wear 140
- Visual inspection 140
- Cleaning connectors 141
- Connector care supplies 141
- Purpose of the 142
- The Calibration 142
- System Maintenance 143
- Detector Gain Calibration 143
- Conversion Loss Calibration 144
- Theory of Operation 145
- 50 to 75 GHz Band or 149
- 50 to 85 GHz Band 149
- RF Leveling vs 150
- IF Leveling 150
- Advantages of IF leveling 151
- Programmable gain 151
- Detector 151
- Multiplying DAC 152
- Blanking circuit 153
- Spurious error messages 153
- Detector gain calibration 154
- Frequency-related variations 155
- Level control performance 155
- System Block Diagrams 157
- HP E7350 159
- Rev. 5 2/17/98 159
- Rev. 7 3/5/98 161
- Option 006 163
- Option 005 163
- HP E7340 167
- Rev. 6 2/17/98 167
- Hardware 173
- Configuration Check 173
- Firmware 174
- Define the problem 175
- Record any error messages 175
- 8510C diagnostics 175
- Check unratioed power levels 175
- Troubleshooting 176
- 6 Replaceable Parts 177
- Replaceable Parts 178
- Categorization of 179
- Components 179
- 110 GHz Systems 180
- Millimeter-Wave 182
- Subsystem 182
- 85 GHz Systems 183
- Millimeter-Wave Controller 186
- 7 Menus & Commands 189
- Menu Maps 190
- Rev. 1 3/10/98 198
- Modify Cal Kit 198
- New GPIB Commands 211
- Menus & Commands 212
- Unsupported GPIB Commands 215
- New Messages 217
- Warnings messages 218
- Numerics 219
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